btechcorp introduces TP-1 Z-axis electrically and thermally conductive thermoplastic film adhesive. Containing almost 1 million Z-axis nickel fibers per cm², TP-1 film is highly electrically conductive and has a lower total bonded joint thermal resistance than silver filled adhesives.

TP-1 has been developed to meet the low temperature and pressure bonding requirements of OLED displays…..125ºC at 0.35 MPa (50 psi). Bonding is instantaneous at these conditions and no post-bonding cure is needed.

Due to the repeatable hot melt capability of thermoplastics, TP-1 allows staged assembly. For example, TP-1 can be laminated to driver chips and then later the driver chips bonded to PET display substrates.

Since TP-1 strongly bonds to all plastic and metal substrates, it has excellent lap shear and peel strength properties. With a much lower modulus (< 0.10 GPa) than epoxies, TP-1 offers outstanding CTE mismatch stress absorption.

High X-Y electrical insulation on the outer surface of each nickel fiber allows ultra fine spacing between pads.

btechcorp also offers custom thermoplastic resin versions of this ACF product to meet unique application requirements.

btechcorp introduces the TP series of Z-axis electrically and thermally conductive thermoplastic film adhesives. Containing almost 1 million Z-axis nickel fibers per cm², TP films are as electrically conductive as solder and have a lower total thermal resistance than silver filled adhesives.

TP films use 8 micron diameter nickel fibers with 3 micron spacing between fibers. Very high X-Y electrical insulation on the outer surface of each fiber means that TP can be used for circuits with as little as 8 micron spacing between pads.

Due to the repeatable hot melt capability of thermoplastics, TP films allow staged assembly. For example, TP can be laminated to a bumpless wafer and after dicing the die can then be bonded to packaging substrates.

Since TP strongly bonds to all metal substrates, it has excellent lap shear and peel strength properties. With a much lower modulus (< 0.10 GPa) than epoxies, TP offers outstanding CTE mismatch stress absorption.

The TP series uses three different thermoplastic resins to offer application flexibility in bonding temperature and thermal cycling capability. Bonding temperature options are 125°C, 150°and 185°C. Thermal cycling capability ranges from -50°C to +90°, +130°C and +160°C.

btechcorp also offers custom thermoplastic resin versions of this TP product family to meet unique application requirements.

Since NTP strongly bonds to plastic and all metal substrates, it has excellent mechanical as well as electrical properties for Z-axis connection of printed plastic circuits.  Very high X-Y electrical insulation means that NTP can be used for circuits with as little as 200 micron spacing between pads.

The NTP series uses three different thermoplastic resins to offer application flexibility in bonding temperature and thermal cycling capability.  Bonding temperature options are 125C, 150C and 185C.  Thermal cycling capability ranges from -50C to +90C, +130C and +160C.

For example, a SUSS MicroTek FC150 flip chip bonder was used to bond a die to a PCB (0.013″ thick) with TP-2 (150C resin bonding temperature).  When the PCB was placed on a 165C hot plate it took 12 seconds to reach 150C on the bonding surface.  FC150 bonding trials were conducted with 190C bond head, 165C work stage, 50 psi for 15 seconds…but without an attached thermocouple there was no way to tell if the resin reached 150C.  It did not reach 150C and the resulting poor bond did not make any flip chip electrical interconnects.

Much shorter bond times for die attach to PCB either need the PCB surface to be pre-heated or the TP-2 to already be laminated to the PCB prior to final bonding.

We welcome your questions and comments about your own experience with our highly electrically and thermally conductive thermoplastic adhesive films.