btechcorp introduces TP-1 Z-axis electrically and thermally conductive thermoplastic film adhesive. Containing almost 1 million Z-axis nickel fibers per cm2, TP-1 film is highly electrically conductive and has a lower total bonded joint thermal resistance than silver filled adhesives.
TP-1 has been developed to meet the low temperature and pressure bonding requirements of OLED displays…..125ºC at 0.35 MPa (50 psi). Bonding is instantaneous at these conditions and no post-bonding cure is needed.
Due to the repeatable hot melt capability of thermoplastics, TP-1 allows staged assembly. For example, TP-1 can be laminated to driver chips and then later the driver chips bonded to PET display substrates.
Since TP-1 strongly bonds to all plastic and metal substrates, it has excellent lap shear and peel strength properties. With a much lower modulus (< 0.10 GPa) than epoxies, TP-1 offers outstanding CTE mismatch stress absorption.
High X-Y electrical insulation on the outer surface of each nickel fiber allows ultra fine spacing between pads.
btechcorp also offers custom thermoplastic resin versions of this ACF product to meet unique application requirements.
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