btechcorp Data Sheets
| Anisotropic Conductive Film (ACF) | Product | Wafer Lamination | Easy Rework | Max Temp | Pitch Density |
| High density Displays | TP-1 |  |
|
90 °C | 11 µ |
| Flip Chip Interconnect: replaces bumps/underfill | TP-2 | |
|
130 °C | 11 µ |
| LED (flip chip package) | TP-3 | |
|
160 °C | 11 µ |
| PET with conductive ink (120 °C bond temp) | NTP-1 | |
|
90 °C | <200 µ |
| Lead free solder | NTP-3 | |
|
160 °C | |
|
Thermal Interface material (TIM) - Die attach - Heat sink attach |
Thermal Resistance (includes interface losses) |
||||
| Highly conductive graphite fibers | HM-2 | |
|
160 °C | 0.06 °C – cm²/W |
| High temperature thermoplastic | NTP-3 | |
|
160 °C | 0.20 °C – cm²/W |
| Low modulus thermoplastic | NTP-2 | |
|
4°K – 130°C | 0.20 °C – cm²/W |