Highly Thermally Conductive Z-axis Adhesive Film btechcorp uses millions of graphite fibers per square inch aligned through the thickness of a thermoplastic adhesive to produce a Thermal Interface Material with very low thermal resistance….HM-2. We just completed the first phase of our program to further reduce the HM-2 resistance by 25% for the thicker bondlines […]

Microelectronics Reliability 52 (2012) 2443-2446, Yasushi Yamada A power semiconductor module using a bonding film with anisotropic thermal conduction has been studied. The bonding film consists of polyamide with a low Young’s modulus and Z-axis-oriented fine graphite fibers. All the materials of this device, including the insulated substrate and base plate, have low coefficients of […]