Highly Thermally Conductive Z-axis Adhesive Film

Highly Thermally Conductive Z-axis Adhesive Film btechcorp uses millions of graphite fibers per square inch aligned through the thickness of a thermoplastic adhesive to produce a Thermal Interface Material with very low thermal resistance….HM-2. We just completed the first phase of our program to further reduce the HM-2 resistance by 25% for the thicker bondlines […]

Power Semiconductor module using HM-2 bonding film with anisotropic thermal conduction

Microelectronics Reliability 52 (2012) 2443-2446, Yasushi Yamada A power semiconductor module using a bonding film with anisotropic thermal conduction has been studied. The bonding film consists of polyamide with a low Young’s modulus and Z-axis-oriented fine graphite fibers. All the materials of this device, including the insulated substrate and base plate, have low coefficients of […]

Ultra Fine Pitch Thermoplastic ACF Adhesive

New Product Ultra Fine Pitch Thermoplastic Anisotropic Conductive Adhesive (ACF) Adhesive for Bumpless Flip Chip Packaging and Advanced Displays btechcorp introduces the TP series of Z-axis electrically and thermally conductive thermoplastic film adhesives. Containing almost 1 million Z-axis nickel fibers per cm2, TP films are as electrically conductive as solder and have a lower total […]