TP-3 High Density Anistropic Conductive Film (ACF)
btechcorp has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix… up to 20 million fibers per square inch.
High conductivity metallic fibers provide a continuous path through the thickness of the film., thus avoiding the particle-to-particle contact problem of filled adhesives.
TP-3 High Density Anisotropic Conductive Film (ACF) adhesive is currently being qualified for a variety of applications, including display interconnect, replacing wafer bumps and underfill for flip chip packaging, and lead-free solder replacement.
|Electrical Resistance||Z-axis: 0 microhms (1.0 cm², 100µ thick). X-Y plane: >20 megaohm|
|Z-Axis Connection Density||11μ pitch|
|Z-Axis Thermal Resistance||<0.20 ⁰C-cm²/W (100µ thick bond)|
|Coefficient of Thermal Expansion||Z-Axis: 15 ppm/⁰C, X-Y plane: 45ppm/⁰C|
|Young’s Modulus||<75 Ksi (0.45 GPa)|
|Ionic Purity||Hydrolyzable Chloride <5 ppm
Hydrolyzable Sodium <2ppm
|Operating Temperature||-50 ⁰C to 160⁰C|
|Product Form||Film pre-forms for reel supply or wafer applications prior to dicing. 2-8 mils (0.05-0.20 mm) thick, +/- 0.1 mil|
|Cure Cycle||50 psi bond compression (<3 sec) at 190 ⁰C (resin temperature)|
|Storage Life||6 months at 27 ⁰C (80 ⁰F)|