TP-3 High Density Anistropic Conductive Film (ACF)
btechcorp has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix… up to 20 million fibers per square inch.
High conductivity metallic fibers provide a continuous path through the thickness of the film., thus avoiding the particle-to-particle contact problem of filled adhesives.
TP-3 High Density Anisotropic Conductive Film (ACF) adhesive is currently being qualified for a variety of applications, including display interconnect, replacing wafer bumps and underfill for flip chip packaging, and lead-free solder replacement.
TP-3 Properties
| Electrical Resistance | Z-axis: 0 microhms (1.0 cm², 100µ thick). X-Y plane: >20 megaohm |
| Z-Axis Connection Density | 11μ pitch |
| Z-Axis Thermal Resistance | <0.20 ⁰C-cm²/W (100µ thick bond) |
| Coefficient of Thermal Expansion | Z-Axis: 15 ppm/⁰C, X-Y plane: 45ppm/⁰C |
| Young’s Modulus | <75 Ksi (0.45 GPa) |
| Ionic Purity | Hydrolyzable Chloride <5 ppm Hydrolyzable Sodium <2ppm |
| Operating Temperature | -50 ⁰C to 160⁰C |
Processing
| Product Form | Film pre-forms for reel supply or wafer applications prior to dicing. 2-8 mils (0.05-0.20 mm) thick, +/- 0.1 mil |
| Cure Cycle | 50 psi bond compression (<3 sec) at 190 ⁰C (resin temperature) |
| Storage Life | 6 months at 27 ⁰C (80 ⁰F) |